The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 1985
Filed:
Jun. 07, 1983
Applicant:
Inventors:
Tasao Soga, Hitachi, JP;
Takaya Suzuki, Katsuta, JP;
Masahiro Okamura, Hitachi, JP;
Masahiro Gooda, Hitachi, JP;
Fumiyuki Kobayashi, Sagamihara, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C / ;
U.S. Cl.
CPC ...
420589 ; 219 / ; 22826311 ; 420580 ;
Abstract
This invention provides a thermal fatigue resistant, low-melting point solder alloy consisting of 13 to 20% by weight Bi, 42 to 50% by weight, Pb, the balance being Sn. This solder alloy is suited for lap joints of electronic parts into or onto a printed substrate or a hybrid substrate.
Soga, Tasao. (1985). Thermal fatigue resistant low-melting point solder alloys (U.S. Patent No. 4491562). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4491562
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile