The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 1984
Filed:
Oct. 07, 1983
Hajime Sakano, Hirakata, JP;
Akitoshi Ito, Mie, JP;
Motoichi Yano, Osaka, JP;
Yasuhiro Honda, Toyonaka, JP;
Sumitomo Naugatuck Co. Ltd., , JP;
Abstract
A thermoplastic resin composition excellent in impact resistance and moldability and improved in falling ball impact strength at a weld part which comprises (A) a polycarbonate resin having a reduced viscosity at 25.degree. C. in chloroform of 0.40 to 0.55 and (B) a diene-rubber modified resin comprising 10 to 100% by weight of a graft polymer of a diene rubber chosen from polybutadiene, styrene/butadiene copolymer and butadiene-acrylonitrile copolymer, with an aromatic vinyl compound and at least one of a vinyl cyanide and an alkyl unsaturated carboxylate grafted thereon and 90 to 0% by weight of a copolymer of an aromatic vinyl compound with at least one of a vinyl cyanide and an alkyl unsaturated carboxylate. The diene-rubber modified resin has apparent melt viscosities at 250.degree. C. of 5.times.10.sup.3 to 1.times.10.sup.5 poise at a shear rate of 10.sup.2 sec.sup.-1 and of 1.5.times.10.sup.3 to 1.times.10.sup.4 poise at a shear rate of 10.sup.3 sec.sup.-1, the weight proportion of the components (A) and (B) being from 20:80 to 80:20.