The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 1984
Filed:
Sep. 20, 1982
Chung J Lee, Sheboygan, WI (US);
Plastics Engineering Company, Sheboygan, WI (US);
Abstract
The resins described herein are polyimide-epoxy thermoset resins prepared by reacting a polyepoxide in two steps, first with a solution of a polyimide dianhydride and subsequently with a polyimide diamine, there being enough polyepoxide added initially to react completely with all the anhydride groups and preferably enough polyepoxide added initially to react with both the anhydride and amide groups. 'Polyimide dianhydride' is an anhydride-terminated polyimide and 'polyimide diamine' is an amine-terminated polyimide as represented by the respective formulas: ##STR1## and ##STR2## wherein Ar', Ar and n are as defined hereinafter. For use in the present compositions, the polyimide dianhydride has an anhydride activity of at least 0.17 as defined herein, and the ratio of epoxy equivalent to anhydride plus amine equivalents is at least 1/1. By employing a two step reaction scheme, the process offers a more tractable polyimide-epoxy intermediate resin that can be processed into void-free products with superior mechanical properties than polyimide-epoxy thermosets shown in the prior art.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile