The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 1984
Filed:
Jul. 14, 1982
Yoshihiko Doi, Hyogo, JP;
Nobuo Ogasa, Hyogo, JP;
Akira Ohtsuka, Hyogo, JP;
Tadashi Igarashi, Hyogo, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
The invention relates to semiconductor chip mounting substrate for use in semiconductor apparatus, wherein metal material or multi-laminated metal material is coated on its surface and/or lateral faces with thin film of insulated inorganic matter in order to obtain an insulated substrate not only capable of efficiently radiating the heat developed in the semiconductor chip but also having thermal expansion coefficient approximate to that of the semiconductor chip, or further coated with film of Cu or Al so that the substrate is provided with high thermal conductivity and required thermal expansion characteristics thereby enabling to produce semiconductor apparatus highly effective for the acceleration of increase of density, reduction of size and improvement of radiation of IC.