The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 1984
Filed:
May. 24, 1982
Lloyd D Ingle, Valley Center, CA (US);
The Micromanipulator Co., Inc., Carson City, NV (US);
Abstract
A wire bonder apparatus for use in connecting a conductor wire to a conductive element on a work piece, such as a microelectronic chip or wafer. The bonder apparatus includes a work piece support station adapted to support a work piece observable through a microscope viewing arrangement, and a bonding head having a support arm on which is mounted a bonding tool and selectively movable wire clamping arms adapted to incrementally feed a bonding wire to the bonding tool. The support arm is caused to undergo a ramped movement so as to effect a predetermined progressively increasing contact force between the bonding tool and the work piece. In one embodiment, the clamping arms are adapted for cooperation with actuator means so as to effect incremental stepped arcuate movement of clamping fingers along the path traversed by the conductor wire whereby to lineraly advance the bonding wire when gripped by the clamping fingers. Bonding wire supply means are selectively operable so as to maintain a desired tension in the bonding wire.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile