The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 1984
Filed:
Apr. 08, 1982
Iwao Imai, Yokosuka, JP;
Hiroshi Endo, Yokosuka, JP;
Masazumi Sone, Yokosuka, JP;
Hideo Kasuya, Yokosuka, JP;
Nissan Motor Company, Limited, Yokohama, JP;
Abstract
A device for preventing noise leakage externally from a digital electronic apparatus using a clock pulse generator, comprising: (a) a metal casing; (b) a printed circuit board housed within the metal casing into which the digital electronic apparatus is assembled having a plurality of land patterns formed thereon at the end of various signal lines of the digital electronic apparatus; (c) a connector attached at one end of the printed circuit board having a plurality of connector pins therewithin for connecting said land patterns with external various apparatus; (d) an insulative film positioned on one surface of the printed circuit board closely adjacent to the land patterns; (e) a conductive film coated on one surface of the insulative member and coupled electrically to the metal casing; and (f) a plurality of chip-type capacitors which bridges between the conductive film and plurality of land patterns for effecting noise filtering and a method of manufacturing the device described above comprising the steps of: (a) coating a solder-resisting film on the conductive film except a portion to which the chip-type capacitors are connected and a portion to which the metal casing is electrically connected; (b) electrically connecting the conductive film to the plurality of chip-type capacitors to the land patterns in a soldering with a solder bath; and (c) electrically connecting the conductive film to the metal casing.