The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 1984
Filed:
Dec. 22, 1981
Applicant:
Inventor:
Toshio Ohta, Tokyo, JP;
Assignee:
Nippon Electric Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 73 ; 357 53 ; 357 54 ; 357 68 ; 357 71 ; 357 72 ;
Abstract
In a plastic or resin encapsulated semiconductor device, the bonding pad electrodes cannot be covered by a waterproof film. Moisture easily penetrates the plastic or resin coating and/or the boundary between the coating and the bonding wire reaching the phosphorus silicate glass under the bonding pad electrode. This penetrated moisture produces phosphoric acid which in turn corrodes the bonding pad electrodes. The present invention prevents the corrosion of the bonding pad electrodes by eliminating the phosphorus silicate glass under the bonding pad electrode or by separating the bonding pad electrode from the phosphorus silicate glass.