The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 1984

Filed:

Jun. 28, 1982
Applicant:
Inventors:

Kazumasa Chiba, Nagoya, JP;

Nobuo Kato, Aichi, JP;

Kazuhiko Kobayashi, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ;
U.S. Cl.
CPC ...
524606 ; 524413 ; 524433 ; 524437 ; 528324 ; 528338 ; 528339 ; 528340 ; 528346 ;
Abstract

A copolyamide comprised of undecamethylenehexahydroterephthalamide units and hexamethylenehexahydroterephthalamide units having a trans isomer ratio of hexahydroterephthalic acid residues of 57 to 83 percent is provided. The copolyamide is suitable for injection and extrusion molding. The copolyamide is prepared by a process comprising heating an equimolar salt of undecamethylenediamine and hexahydroterephthalic acid and an equimolar salt of hexamethylenediamine and hexahydroterephthalic acid at a maximum temperature of about 280 to 360.degree. C. to stably melt-polymerize the copolyamide. A copolyamide molding composition comprised of the copolyamide and an inorganic reinforcing agent can be formed into various molded articles having excellent properties.


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