The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 1984
Filed:
Nov. 18, 1981
Hideo Arakawa, Hitachi, JP;
Keiichi Kuniya, Hitachi, JP;
Takashi Namekawa, Hitachi, JP;
Masabumi Ohashi, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor substrate having electrodes brazed thereto. The electrode is made of a Cu-C composite material in which carbon fibers are embedded in copper matrix. The carbon fibers are so disposed as to be in a ring-like shape or a loop shape substantially in parallel with a surface of the semiconductor substrate onto which the electrode is brazed. The carbon fibers disposed in an outer peripheral portion have a higher longitudinal elastic modulus than that of the carbon fibers positioned at a central portion of the electrode. The electrode thus has a thermal expansion coefficient approximating to that of the semiconductor substrate. Content of copper can be increased at the central portion of the electrode for attaining a high thermal conductivity.