The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 1984
Filed:
Aug. 11, 1982
Yutaka Okinaka, Madison, NJ (US);
Craig G Smith, North Plainfield, NJ (US);
Lawrence E Smith, Plainfield, NJ (US);
AT&T Bell Laboratories, Murray Hill, NJ (US);
Abstract
A copper electroplating process is described in which the anode is surrounded by a cation-permeable membrane so as to prevent decomposition of additives in the electrochemical bath. Such a feature adds to bath lifetime and permits better control of bath chemistry and plating quality during the electroplating process. The feature is especially advantageous for copper electroplating processes using nonconsumable electrodes because of the high consumption of additives and that the copper can be added to the cathode side of the membrane so that acid copper ions need not pass through the membrane.