The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 1984
Filed:
Oct. 12, 1982
Imre Bajka, Niederglatt, CH;
Robert Furrer, Zurich, CH;
Siemens Aktiengesellschaft Berlin & Munchen, Munich, DE;
Abstract
The solder applying apparatus enables applying solder to both sides or faces of printed-circuit boards travelling essentially in horizontal direction through a production or manufacturing line, and which circuit boards are not yet equipped with electrical components or the like. The apparatus contains a solder applicator means or device where liquid solder is pumped from a supply container in such a quantity that a solder wave forms over an outlet or discharge opening of the applicator device. This solder wave extends beyond the feed or transport plane of the printed-circuit boards. At the side walls of the applicator solder device there are mounted guide elements formed of metal plating or sheet metal which extend beneath the feed plane, the solder flowing-off by means of such guide elements. The angle of inclination of the metal guide elements is adjustable with respect to the feed plane. Also the spacing between the discharge opening of the applicator solder device and the feed plane is variable. Directly above or below, as the case may be, the feed plane there are arranged substantially cylindrical-shaped elements at the inlet side and the outlet side where the printed-circuit boards respectively inbound and outbound from the solder applying apparatus. These cylindrical-shaped elements are disposed at the regions of the ends of the guide elements and extend transversely with respect to the direction of feed or advance of the printed-circuit boards. These cylindrical-shaped elements function, on the one hand, as solder strippers or scrapers and, on the other hand, as limiting means for the solder blanket which during the through-passage of a printed-circuit board tends to spread-out at the upper surface or face thereof.