The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 1984
Filed:
Nov. 16, 1983
Lillie C Tomaszewski, Dearborn, MI (US);
Robert A Tremmel, Woodhaven, MI (US);
OMI International Corporation, Warren, MI (US);
Abstract
A process for depositing a ductile, fine-grained adherent copper plate on a conductive substrate employing an electrolyte containing controlled effective amounts of cupric ions, a complexing agent for the cupric ions, a bath stabilizing and buffering agent, and hydroxyl and/or hydrogen ions to provide a pH from about 6 to about 10.5. The process includes electrolyzing the aforementioned electrolyte employing a combination of a bath soluble copper anode and an insoluble nickel-iron alloy anode containing about 10 percent to about 40 percent by weight iron and about 0.005 to about 0.06 percent sulfur to provide a copper anode area to nickel-iron alloy anode surface area ratio within a range of about 1:2 to about 4:1. The invention further contemplates a novel nickel-iron alloy anode for use in the practice of the disclosed process.