The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 1984
Filed:
Jun. 11, 1982
Applicant:
Inventors:
Mitsukiyo Tani, Hadano, JP;
Seiichi Kawashima, Hadano, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
219 / ; 219 / ; 219 / ;
Abstract
A small-sized light-weight resistance reflow soldering apparatus for modifying the wiring pattern on a printed circuit board, with the soldering apparatus including a heating device with an adjustable weight, a supporting mechanism for a vertically movably supporting the heating device, a welding power supply for making the heating device produce heat enough to melt the solder for a predetermined time length, and a case accomodating these constituents. The soldering is effected by the heating device which produces the heat while being pressed against the jointing surface.