Superconducting circuit fabrication

Abstract

An improved method of anodization of thin films for the fabrication of superconducting devices. An electrically conducting contact layer is formed over a substrate between an electrically conducting object layer and the substrate. Also, an electrically insulating layer is formed between the object layer and the contact layer. The contact layer is connected to a power supply and at least a preselected portion of the object layer is anodized to a predetermined thickness. This may include anodizing all of some preselected portions through the complete thickness of the object layer. A pattern of hardened photoresist on the object layer provides portions not protected by the pattern. When anodization of the electrically conducting object layer takes place, the resulting anodized portion is thicker than the thickness of the portion of the object layer that it replaces. The present invention further includes reducing the preselected portion of the object layer to be anodized by a predetermined amount before anodizing so that when anodization is complete, the resulting partially anodized partially conducting object layer is substantially planar. Alternatively, the thickness of the anodized preselected portions can be reduced after anodizing by a predetermined amount to cause the layer to be substantially planar. The same pattern of hardened photoresist can be used when reducing the thickness of portions of the object layer or anodized preselected portions.