The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 1984

Filed:

Mar. 17, 1983
Applicant:
Inventors:

Takashi Yabu, Yokohama, JP;

Masao Kanazawa, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; B44C / ; C03C / ; C23F / ;
U.S. Cl.
CPC ...
156653 ; 29578 ; 29580 ; 148187 ; 156643 ; 156656 ; 156657 ; 1566591 ; 156662 ; 357 41 ; 357 49 ; 357 59 ; 427 88 ; 427 93 ; 430317 ; 430318 ;
Abstract

A method for producing a semiconductor device provided with a fuse including the steps of forming a fuse layer on an insulating layer formed on a semiconductor substrate, forming an interrupting layer covering the fuse layer and the insulating layer, forming an insulating protective layer covering the interrupting layer, selectively etching the protective layer, so as to form a window, with a suitable etchant which does not etch the interrupting layer, and etching the exposed interrupting layer to complete the window by which a portion of the the fuse layer and a portion of the insulating layer are exposed. The insulating layer is not removed so that the reliability of the semiconductor device will not deteriorate.


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