The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 1984
Filed:
Feb. 28, 1983
Nitto Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A method for bonding which comprises: interposing between the articles to be bonded at least one of which has an aqueous moisture content in a normal condition of at least about 1% by weight based on the weight of the article, a moisture curable adhesive material and then heating the assembly under pressure to supply water vapor from the moisture-containing article to cure the adhesive material, wherein said adhesive material comprises a sheet, film or tape of a thermofusible adhesive resin and/or rubber containing about 0.1 to 20% by weight based on the weight of the resin and/or rubber of a carboxyl group and not more than about 0.5% by weight free water and uniformly dispersed therein, a powder of an oxide of a metal of Group IIa of Mendeleev's Periodic Table having an average particle diameter of about 0.1 to 1,000.mu..