The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 1984

Filed:

May. 12, 1982
Applicant:
Inventors:

Gary M Rapps, Sunrise, FL (US);

Alvin Feder, Lauderhill, FL (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
310348 ; 310320 ; 310366 ;
Abstract

A low-profile crystal package wherein the wire bonding operation from the electrode pattern of the crystal plate to the terminal posts may be accomplished without fear of fracture of the crystal plate itself. The crystal blank is positioned on a support member which in turn initially sits on a ring of indium. In this position, the crystal blank is not in contact with the split center support post whose top surface is covered with indium paste, and is supported around its periphery during wire bonding. When all the wire bonding operations are effectuated, the assembly is subjected to sufficient heat wherein the indium material will melt, which will cause the support member to be drawn downward, thereby resulting in the crystal plate being supported and fastened only by the center supports, with the periphery of the crystal plate being free to vibrate with no extraneous dampened support.


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