The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 1984

Filed:

May. 04, 1981
Applicant:
Inventors:

Victor H Clausen, Vancouver, WA (US);

Paul Kaplan, Peapack, NJ (US);

Assignee:

H. B. Fuller Company, St. Paul, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ;
U.S. Cl.
CPC ...
428 35 ; 156166 ; 156210 ; 156310 ; 156320 ; 428105 ; 428112 ; 428182 ;
Abstract

A process of reinforcing a sheetlike substrate by applying a plurality of linear reinforcements comprising a filamentary core having a pre-coating of 'hot melt' adhesive to the substrate with at least one of the linear reinforcements applied in a generally serpentine or waveform pattern to provide both in-machine and cross-machine tensile strength and tear resistance. The present invention is also an improved reinforced sheetlike substrate having the linear reinforcements applied thereon in accordance with the process. In one embodiment, adjacent linear reinforcements are applied in an overlapping or interlocking serpentine configuration onto the substrate. In one embodiment of the process, the sheetlike substrate is conducted along a path defined as the in-machine direction while the plurality of linear reinforcing members are fed through a guide member that is reciprocating transversely with respect to the in-machine direction. The temperature of the thermoplastic adhesive is raised above its softening point and then allowed to harden to bond the linear reinforcing members onto the substrate.


Find Patent Forward Citations

Loading…