Automatic liquid dispensing apparatus for spinning surface of uniform

Abstract

An automatic fluid dispensing apparatus for coating to a substantially uniform thickness a rotating surface, such as the surface of a semiconductor wafer, with a viscous liquid, such as a slurry of passivating glass. The wafer rotation rate is related to the radial movement of a dispensing arm to maintain a constant tangential velocity of the wafer at the radial location of the dispensing arm while a bead of the slurry is dispensed at a constant rate proportional to the tangential velocity to provide a spiral beaded coating of constant volume per square. By allowing the bead to heal during or following the dispense cycle, the viscous liquid spreads to a uniform thickness.