The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 1984
Filed:
Oct. 21, 1982
Kazuhisa Ishibashi, Tokyo, JP;
Hideo Kurashima, Yokosuka, JP;
Hisakazu Yasumuro, Yokohama, JP;
Michio Watanabe, Yokohama, JP;
Tsuneo Imatani, Yokosuka, JP;
Kazuo Taira, Tokyo, JP;
Seishichi Kobayashi, Yokohama, JP;
Hiroshi Ueno, Yokosuka, JP;
Toyo Seikan Kaisha, Ltd., Tokyo, JP;
Abstract
Disclosed is a process for the preparation of metal vessels, which comprises lap-bonding both the circumferential end portions of upper and lower members, each consisting of a seamless formed metal cup, through a layer of a hot adhesive interposed therebetween, wherein a high frequency induction heating coil is arranged so that the coil covers a part, smaller than the semicircle, of the circumferential portion to be formed into a seam, which circumferential portion consists of said end portions engaged with each other through the hot adhesive layer, electricity is applied to the heating coil to induce an eddy current passing through said end portions and the circumferential portion and the heating coil are rotated relatively to each other, whereby both the end portions are heated and a seam is formed by heat bonding.