The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 1984

Filed:

Sep. 02, 1982
Applicant:
Inventor:

Donald A Arcilesi, Mt. Clemens, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
4274431 ; 106-123 ; 106-126 ; 427305 ; 427437 ;
Abstract

A process and composition for use in electroless copper plating where the process includes contacting a substrate with a solution comprising copper, a complexing agent, a reducing agent, and a pH adjuster. A stabilizer may also be used. The improvement of the present invention includes contacting the substrate with a solution further comprising ammonium ions present in an amount effective to function as a plating rate controller. The improved solution is relatively stable, easy to control, and is of versatile use.


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Arcilesi, Donald. (1984). Ammonium ions used as electroless copper plating rate controller (U.S. Patent No. 4450191). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4450191

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