Assembling components such as lids to chip enclosures

Abstract

First components such as lids (9) are assembled to second components such as electronic chip carriers (10). Each lid (9) has an external surface opposite a first mating face and each carrier (10) has a second mating face complementary with the first mating face of the lid (9). An assembly station contains a first frame (30) having first walls (31-35) for confining and first ledges (37-38) for supporting a lid (9). Frame (30) has an advantageous peripheral opening (39) suitable for passing therethrough portions of devices for transferring lids (9). Preferably such stations (25) are established in an array suitable for access by an array of lids (9) transferred by a first device (35). A first magazine (70) holds files of lids (9) with external surfaces of leading ones in an array for contact, pickup and transfer. The first device (55) has a plurality of fingers (62) with vacuum pickup portions (64) presenting an array of faces (66) to contact and pickup an array of lids (9) from the first magazine (70) and for releasably retaining the same. Device (55) is moved along a path to the first frame (30) and the fingers (62) pass therethrough in an inverted manner. Thus an array of lids (9) are transferred into the frames (30) in a preferably flat orientation with mating faces turned upward. An escapement (105) is then preferably actuated to permit a second magazine to guidably deliver an array of leading carriers (10), with mating faces downward upon the upturned lids (9).