The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 1984

Filed:

Sep. 24, 1982
Applicant:
Inventors:

James R Cisar, Cuyahoga Falls, OH (US);

Attila Grauzer, Akron, OH (US);

Assignee:

U.C. Industries, Tallmadge, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D / ; B29F / ; G01B / ;
U.S. Cl.
CPC ...
425141 ; 264 405 ; 264 51 ; 264101 ; 425135 ; 425138 ; 425466 ; 4258 / ;
Abstract

A foam extrusion die and monitoring apparatus, including a pair of adjustable die lip members having opposed, rigid die lips defining therebetween an elongated arcuate die orifice, is characterized by position sensors located along the arc of the die lips to monitor the die opening at such locations. The position sensors include sensing styli mounted for movement with the lip members at respective sensing locations such as at the arc ends and arc centers of the die lips, and provision is made for connecting the sensing styli as by precision push-pull, flexible cables to respective linear variable displacement transformers which provide electrical output signals representative of sensed positions to remotely located monitoring circuitry. The apparatus has particular application in a vacuum extrusion line wherein the extrusion die is located inside a vacuum chamber and thus is inaccessible during extrusion. In such application, the apparatus provides immediate read-out of die lip position data outside of the vacuum chamber for use in accurately obtaining and maintaining desired die orifice size and shape.


Find Patent Forward Citations

Loading…