The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 1984

Filed:

Mar. 31, 1982
Applicant:
Inventor:

John R Hopkins, Cambridge, MD (US);

Assignee:

AMP Incorporated, Harrisburg, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; H01R / ;
U.S. Cl.
CPC ...
339 / ; 29827 ; 29883 ; 174 / ;
Abstract

A method is disclosed for forming a package for leadless integrated circuit substrates. Two identical webs of conductive material are formed into ladder like arrays of parallel terminals. One web has first housing portions formed on opposite ends of the terminals which are then formed on the housing portions. The second web is placed overlying the first web and between the first housing portions and second housing portions molded thereon integral with the first housing portions. The second terminals are then formed to finish the package.


Find Patent Forward Citations

Hopkins, John. (1984). Method and apparatus for producing a premolded packaging (U.S. Patent No. 4445736). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4445736

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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