The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 1984

Filed:

Feb. 16, 1983
Applicant:
Inventors:

Yosuke Sakakibara, Higashimurayama, JP;

Takao Kasai, Tokorozawa, JP;

Tsuneji Takasugi, Hanno, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C / ;
U.S. Cl.
CPC ...
420511 ; 420587 ;
Abstract

This gold solder comprises an Au-Cu-Ag-Ge alloy with 3 to 6% germanium and has a melting temperature of 800.degree. C. or below. The gold content of the gold solder is 50 to 70% equivalent to 12 to 16 Karat. The gold solder that exhibits corrosion resistance corresponding to that of materials such as a gold alloy, stainless steel, stellite and sintered carbide makes it possible to solder at 800.degree. C. or below ornamental parts made of the above materials. As a result, any surface degradation is prevented during the soldering process of mirror-polished ornamental parts.


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