The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 1984
Filed:
Mar. 01, 1982
Applicant:
Inventors:
Hermanus A van de Pas, Nijmegen, NL;
Huibert A Knobbout, Nijmegen, NL;
Assignee:
U.S. Philips Corporation, New York, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228159 ; 228179 ;
Abstract
A method of providing a raised contact portion on a contact area of an electronic microcircuit in which a ball is formed at one end of a metal wire by means of thermal energy, the ball is pressed against a contact area of the electronic microcircuit and is connected to said contact area. A weakening is created in the wire near the ball and the wire is then severed at the area of the weakening to provide the desired raised contact portion.