The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 1984
Filed:
Jul. 15, 1982
Shunsuke Matsuda, Osaka, JP;
Akio Ito, Katano, JP;
Mitani Katsuaki, Kyoto, JP;
Murakami Yoshinobu, Katano, JP;
Tamura Tooru, Ikeda, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A heat cycle injection compression molding method comprises several steps: heating a synthetic resin until it becomes fluidized; injecting the fluidized synthetic resin into a large and nonuniform cavity formed by a cavity block and a mold which is slightly opened; cooling the injected fluidized resin until the center portion temperature of the resin is equal to or lower than a solidifying temperature of the resin, thereby solidifying the resin; reheating the solidified resin uniformly until the temperature of the resin is higher than the solidifying temperature, thereby making the resin fluidized again; compressing the refluidized resin by reducing the volume of the cavities; cooling the refluidized resin until the temperature of the refluidized resin is lower than a take-out set temperature, while continuing the compressing step, thereby resolidifying the resin; stopping the compressing step; and ejecting out of the mold a formed product having a large and nonuniform thickness.