Non-hermetically sealed stackable chip carrier package

Abstract

An improved stackable integrated chip carrierassembly is disclosed which is especially suited for use in printed circuit board with dense configuration of components in limited areas of surface. The chip carrier assembly is mounted on an associated circuit board and allows the vertical stacking of active components in chip form, integral therein. The interconnections of the associated integrated circuit chips are accomplished without soldering which lends itself for easy disassembly when it becomes necessary to remove or replace an internal chip. The chip carrier assembly has an adaptable design allowing single or vertically stacked utilization of the module-like package. To achieve the necessary electrical isolation property, a ceramic cap is placed at the upper most position relative to the integrated module assembled package. This design has relatively few parts and allows smaller diameter wire to be used to achieve the required integrated circuit chip to package electrical bonding connections, when such is required.