The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 1984
Filed:
Jun. 11, 1982
Applicant:
Inventors:
Assignees:
Kabushiki Kaisha Toyota Chuo Kenkyusho, all of, JP;
Kabushiki Kaisha Tokai Rika Denki Seisakusho, all of, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F / ;
U.S. Cl.
CPC ...
148-6 ; 148-611 ; 204 / ; 204 48 ; 427431 ;
Abstract
A process for manufacturing a boride dispersed copper alloy by preparing a metallic material having a surface portion comprising at least one of Al, As, Cd, Co, Cr, Fe, Mg, Mo, Nb, Pt, Ta, W and Zr, and copper or an alloy thereof, and diffusing boron into the surface portion. The resulting material includes fine boride particles uniformly dispersed in the surface portion and is useful as a material for electrical contacts or sliding parts due to its high wear, adhesion and arc resistance and high electrical conductivity.