The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 1984
Filed:
Jun. 11, 1982
Applicant:
Inventors:
Hironori Fujita, Aichi, JP;
Tohru Arai, Aichi, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F / ;
U.S. Cl.
CPC ...
148-6 ; 148-611 ; 204 / ; 204 49 ; 427431 ;
Abstract
A process for manufacturing a boride dispersion copper alloy by preparing a metallic material having a surface portion comprising at least one of beryllium, gallium, manganese, nickel, palladium, silicon and vanadium, and copper or an alloy thereof, and diffusing boron into the surface portion. The resulting material includes fine boride particles uniformly dispersed in the surface portion and is useful as a material for electrical contacts or sliding parts due to its high resistance to adhesion, wear and arc, and excellent electrical conductivity and sliding properties.