The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 1984
Filed:
Sep. 22, 1980
Applicant:
Inventors:
Hiromichi Nakamura, Gifu, JP;
Haruya Urano, Gifu, JP;
Tatsuo Kojima, Gifu, JP;
Mitsunao Sekiwa, Osaka, JP;
Assignees:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Mitsubishi Metal Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23D / ; B23D / ;
U.S. Cl.
CPC ...
83 13 ; 83174 ; 834092 ; 8341 / ; 83676 ;
Abstract
A cutting method comprising using a main body in the form of a circular disk and a hard layer provided on one surface of the main body and having a thickness of 0.02 to 0.2 mm. The hard layer is made of cemented carbides, TiC TaC, Cr.sub.2 C.sub.3, Al.sub.2 O.sub.3 or the like, while the main body is made of a material, such as steel, non-ferrous metal or plastics, which is lower than the hard layer in abrasion resistance. The hard layer is formed along its outer periphery with a cutting edge which is self-sharpened when chipped.