The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 1984

Filed:

Dec. 23, 1982
Applicant:
Inventors:

Kenji Ohsawa, Yokohama, JP;

Takao Ito, Tokyo, JP;

Shimetomo Fueki, Tokyo, JP;

Masayuki Osawa, Atsugi, JP;

Keiji Kurata, Atsugi, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174 685 ; 75228 ; 361411 ;
Abstract

A novel conductive paste is disclosed which is suitable for use to connect circuit patterns of a printed circuit board. The conductive paste comprises a melt of gallium and a metal element which forms an eutectic mixture with gallium, and metal powder which alloys with gallium uniformly dispersed in the melt. The content of the metal element and the metal powder are selected to control a solid content in the paste at a predetermined working temperature.


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Ohsawa, Kenji. (1984). Conductive paste (U.S. Patent No. 4435611). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4435611

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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