The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 1984
Filed:
May. 28, 1982
Larry W Dickey, Hackettstown, NJ (US);
Bell Telephone Laboratories, Incorporated, Murray Hill, NJ (US);
Abstract
A protector unit (30) for protecting tip-and-ring conductors of a telephone loop includes a pair of protector assemblies (40-40') which are supported within a common housing 932). A voltage protection subassembly (42) is connected electrically to a ground subassembly (44) for causing current associated with excessive voltage surges to be conducted to ground. Each protector assembly includes a heat coil subassembly (50) mounted on a dielectric half-base (51), together with a central office pin (57). The heat coil subassembly includes a line pin (61), an eyelet (62), disposed concentrically about the line pin and releasably secured to one end of the line pin in an initial position by a fusible bonding material, and a resistance wire (69), wound about the hub of the eyelet. One end of the wire is welded to the eyelet, and the other end is welded to the central office pin to establish a direct current path between the line pin and the central office pin. The two base halves and the components disposed thereon are held in mated position theretogether by the protector housing. A spring (43) between a cup (93) of the voltage protector subassembly and the housing maintains the voltage protection subassembly in engagement with the eyelet. Also, the spring is effective when current flow exceeds a predetermined level that is sufficient to cause the fusible bonding material to melt to cause the eyelet to be moved to a position where it engages a portion (86) of the grounding subassembly to establish a fault current path to ground potential.