The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 1984

Filed:

Sep. 30, 1982
Applicant:
Inventors:

Ryoichi Sado, Saitama, JP;

Kazutoki Tahara, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
339 / ; 3392 / ; 174 / ;
Abstract

The adjustable and readily solderable sheet-like connector of the invention is composed of an insulating sheet-like elastic body, a plurality of parallel-running wires of a soft and plastically deformable metal or alloy integrally bonded to the surface of the sheet-like body forming an array of parallel electroconductive paths and a soldering layer at least partly covering the exposed array of the metal wires as formed of a composite material composed of a plastically flowable material such as a hot-melt adhesive and particles or chopped fibers of a solder alloy dispersed therein. The connector is easily bent and left in the bent form just like an adjustable ruler to comply with any curved surface of a printed circuit board and readily bonded to the printed circuit board by heating and pressing between hot plates to cause melting of and soldering with the particles or chopped fibers of the solder alloy contained in the soldering layer at the portions just between each set of the metal wires and the connecting terminals on the printed circuit board due to the better heat conduction there than in the other portions at which the soldering layer is left electrically insulating.


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