The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 1984

Filed:

Dec. 17, 1981
Applicant:
Inventors:

James W Cassarly, Huntingdon, PA (US);

Robert W Rollings, Huntingdon, PA (US);

Frank C Youngfleish, Pennsylvania Furnace, PA (US);

Assignee:

Elco Corporation, El Segundo, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
339 / ; 339 / ; 339 / ; 3391 / ;
Abstract

A connector mounting for an integrated circuit chip package having pad-type terminal contacts around its periphery, has a flat synthetic resin housing provided with a recess in its top side for receiving the chip package with its terminal contacts facing downwardly for electrical contact with laterally extending flexible spring contact arm portions of respective contact members mounted in the housing. An electrically conductive metal clamp or cover member is hingedly mounted on the housing to engage and press the chip package downwardly in the housing recess into contact member-engaging position therein. The contact members have rigid contact pin portions firmly anchored in the housing bottom and projecting perpendicularly downward therefrom in row alignment around the housing for plugging into a printed circuit board. The metal clamp member engages and presses down against ground contact means on the chip package to electrically connect and ground the chip package to a metal ground shield which encases the housing and with which the clamp member is engaged.


Find Patent Forward Citations

Loading…