The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 1984
Filed:
Nov. 19, 1982
Francis J Nuzzi, Freeport, NY (US);
John K Duffy, Douglaston, NY (US);
Kollmorgen Technologies Corporation, Dallas, TX (US);
Abstract
An improved process for removing resin smeared on an interior wall of a hole in a resinous substrate and/or adhesion promoting the substrate which comprises: (a) contacting the substrate with an alkaline permanganate treating solution having a pH between about 11 and about 13 and an elevated temperature for a time period sufficient to remove the resin smear; (b) neutralizing essentially all manganese residue on the substrate; (c) contacting the substrate with an alkaline hydroxide etchant to remove the balance of manganese residue on the substrate. A metal such as copper subsequently may be electrolessly deposited in a more efficient and easily controlled manner on the resin substrate in the formation of a wire scribed circuit board or multilayer printed circuit board. In addition to resin smear removal, the process results in an improved bond between copper and the hole wall.