The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 1984

Filed:

Sep. 07, 1982
Applicant:
Inventors:

Sherwood Goldstein, Sinking Spring, PA (US);

Henry T McClelland, Shoesmakersville, PA (US);

Paul J Scherbner, Boyertown, PA (US);

Assignee:

Cabot Corporation, Kokomo, IN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C22F / ;
U.S. Cl.
CPC ...
148-2 ; 148 / ; 148160 ;
Abstract

A process for producing a copper beryllium alloy. The process includes the steps of: preparing a copper beryllium melt; casting the melt; hot working the cast copper beryllium; annealing the copper beryllium; cold working the annealed copper beryllium; and hardening the copper beryllium; and is characterized by the improvement comprising the steps of: solution annealing the cold worked copper beryllium at a temperature of from 1275.degree. (691.degree.) to 1375.degree. F. (746.degree. C.); hardening the annealed copper beryllium at a temperature of from 400.degree. (204.degree.) to 580.degree. F. (304.degree. C.); cold rolling the hardened copper beryllium; and stress relief annealing the cold worked copper beryllium at a temperature of from 400.degree. (204.degree.) to 700.degree. F. (371.degree. C.). An alloy consisting essentially of, in weight percent, from 0.4 to 2.5% beryllium, up to 3.5% of material from the group consisting of cobalt and nickel, up to 0.5% of material from the group consisting of titanium and zirconium, up to 0.3% iron, up to 0.7% silicon, up to 0.3% aluminum, up to 1.0% tin, up to 3.0% zinc, up to 1.0% lead, balance essentially copper. The alloy is characterized by equiaxed grains. The grains have an average grain size of less than 9 microns. Substantially all of the grains are less than 12 microns in size.


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