The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 1984

Filed:

Jul. 28, 1981
Applicant:
Inventors:

Nobuyuki Sugishita, Yokosuka, JP;

Akira Ikegami, Yokohama, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
428209 ; 174 685 ; 338308 ; 361410 ; 361411 ; 428427 ; 428428 ; 428432 ; 428901 ; 428701 ;
Abstract

A thick-film multi-layer wiring board in which the thick-film resistor provided in the inner layer is coated with a glass material selected from (a) and (b) below:


Find Patent Forward Citations

Sugishita, Nobuyuki. (1984). Thick-film multi-layer wiring board (U.S. Patent No. 4424251). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4424251

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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