Binding layer for low overvoltage hydrogen cathodes

Abstract

A cathode for use in electrolytic processes and a process for preparing such cathodes is described. The cathode comprises a cathodically active surface layer, an intermediate binding layer, and a substrate. The intermediate binding layer comprises a codeposit of a first metal selected from the group consisting of iron, cobalt, nickel, and mixtures thereof, and a second metal or metal oxide selected from the group consisting of molybdenum, manganese, titanium, tungsten, vanadium, indium, chromium, zinc, their oxides, and combinations thereof. The intermediate binding layer is applied to the substrate from an electroplating solution containing a soluble sulfur-containing compound, such as an alkali metal thiocyanate or thiourea. The surface layer is applied to the intermediate binding layer and comprises a codeposit of said first and second metals or metal oxides and a third metal selected from the group consisting of cadmium, mercury, lead, silver, thallium, bismuth, copper and mixtures thereof.