The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 1983

Filed:

Aug. 28, 1981
Applicant:
Inventor:

Hitoshi Ikeno, Tokyo, JP;

Assignee:

Seikosha Co., Ltd., Tokyo, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174 / ; 310348 ; 361395 ; 361399 ;
Abstract

A shell of a hermetically sealed package has a through hole and a circuit board is inserted and fixed hermetically into the through hole, and a can is fixed hermetically to the shell. The circuit board consists of a sealed part which is sealed hermetically by the hermetically sealed package, a fixed part to which the shell is fixed, and a projecting part which projects out from the hermetically sealed package. As the circuit pattern extends from the sealed part through the fixed part to the projecting part, it is not necessary to use terminal pins and instead a large number of external lead electrodes are taken out from the hermetically sealed package. An integrated-circuit chip or the like which is sealed by the hermetically sealed package can be shielded from electromagnetic influence by the metallic shell and the metallic can.


Find Patent Forward Citations

Loading…