The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 1983
Filed:
Apr. 06, 1982
Junzi Sugiura, Toyota, JP;
Hiroshi Okada, Hekinan, JP;
Michitaka Hayashi, Kariya, JP;
Toru Yamazaki, Kariya, JP;
Hiroshi Sugimoto, Toyota, JP;
Nippondenso Co., Ltd., Kariya, JP;
Abstract
A semiconductor pressure sensor has an encased sensor unit, and a metal casing having a pressure introduction pipe and housing therein the sensor unit. The metal casing has therein synthetic resin poured by potting to fix the sensor unit securely in the metal casing. Through-type capacitors are affixed to the metal casing. The sensor unit produces an electrical signal transmitted out through the through-type capacitors and over lead wires connected to the through-type capacitors. With this arrangement, the semiconductor pressure sensor is protected against electromagnetic interference (EMI), and moisture is prevented from entering the metal casing.