The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 1983
Filed:
Jan. 12, 1982
Chuji Shibuya, Katano, JP;
Satoshi Kaneda, Takatsuki, JP;
Takashi Kanehisa, Osaka, JP;
Masatoshi Kondo, Hirakata, JP;
Kenji Nogawa, Izumi, JP;
Fumio Hasuike, Hirakata, JP;
Matsushita Electric Industrial Co., Ltd., Kadoma, JP;
Abstract
A disclosed method of continuous making flexible printed circuits for use in radio set or the like appliances, includes punching holes in a continuous copper-film clad insulating substrate, forming photopolymer films on the faces of the copper films exposing the photopolymer film to photochemical light of a predetermined pattern, developing the exposed photopolymer film, etching the copper film utilizing remaining parts of the photopolymer film as etching masks, removing the remaining photopolymer films 40 and printing solder-resist films on selected parts. The improvement is to provide and retain selected oblong parts of said conductor metal film disposed on and parallel to longitudinal direction of the continuous substrate by, for example, covering these parts by etching-resist films. The retained oblong parts of the metal film serve to prevent shrinkage of the substrate during the conduct of further manufacturing steps thereby assuring registration of the patterns of the printed circuits and the printed solder-resist films.