The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 1983
Filed:
Feb. 25, 1981
Nobuhiko Kogo, Nagoya, JP;
Yoshimitsu Tsutsui, Nagoya, JP;
Koji Kato, Nagoya, JP;
Hisao Kishigami, Nagoya, JP;
Mitsubishi Jukogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
A method for controlling the thickness of an extruded, biaxially elongated film product, in which thickness deviations are controlled automatically and without supervision. In the method, correlation between positions along the widthwise direction of a film sheet and positions of die manipulation bolts of an extrusion die is obtained, and initially, a profile of the film sheet prior to lateral elongation is converged into a tolerable range; thereafter, the thickness of the film sheet after lateral elongation is measured, and if there are thickness deviations outside the tolerable range, a thickness regulation is effected by transmitting a signal corresponding to the thickness deviations to the appropriate die manipulation bolts.