The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 1983
Filed:
Jun. 17, 1982
Kunio Miyazaki, Hitachi, JP;
Yukio Okosi, Mito, JP;
Akira Kumagai, Hitachi, JP;
Hitoshi Suzuki, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A method of metallizing ceramics in which, on a desired surface of a ceramic containing a silicon compound, a manganese-containing metal layer substantially free from any minute gaps with respect to the surface of the ceramics is formed, whereupon the resultant structure is heated to a temperature lower than the melting point of manganese to cause the reaction between manganese atoms and the silicon compound. As a method for forming the metal layer, there is a method wherein a deposited film is formed by vacuum-evaporating or sputtering manganese metal or a manganese alloy or a method wherein a melt of a manganese-copper, manganese-nickel or manganese-titanium alloy is formed on the surface of the ceramic under the application of a pressure. The metallizing method can be conducted at a lower temperature and in a shorter period of time compared with a conventional metallizing method.