The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 1983
Filed:
Jan. 02, 1980
Yoshinori Kokubu, Tokyo, JP;
Jiro Chiba, Yokohama, JP;
Nobuyoshi Ichimura, Yokohama, JP;
Takashi Iwai, Yachiyo, JP;
Toshiyasu Kawaguchi, Yokohama, JP;
Asahi Glass Company Ltd., Tokyo, JP;
Iwaki Glass Company Ltd., Tokyo, JP;
Abstract
A sealing glass composition containing refractory filler of lower coefficient of thermal expansion for use in sealing alumina package for electronic components is disclosed. The composition consists essentially of low melting glass powder and cordierite powder in proportion of 2-30% by weight of the total composition, and optionally, .beta.-eucryptite, .beta.-spodumen, lead titanate or zircon in a proportion, respectively, not exceeding 15% by weight of the total composition. The low melting glass has a composition of 77.0-86.0 wt. % of PbO, 6.0-15.0 wt. % of B.sub.2 O.sub.3, 0.5-6.9 wt. % of ZnO, 0.1-3.0 wt. % of SiO.sub.2, 0-3.0% of Al.sub.2 O.sub.3 0-2.0% of alkali earth metal oxide, 0-1.5% of SnO.sub.2 and 0-1.0% of alkali metal oxide.