The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 1983
Filed:
Dec. 14, 1981
Rainer Offenhausen, Springe, DE;
Hans G Schwarz, Springe, DE;
Abstract
Cement bonded boards are manufactured by mixing wooden chip material with cement, additives and water and forming this mixture into a mat from which individual sections corresponding to the desired length of the board blanks are then produced. The individual sections are pressed and then hardened by the application of heat which produces initial setting of the cement. The boards are then left for a period of time so that the cement bond can reach its full strength. After this stage the boards are passed through a conditioning channel to achieve a moisture balance between the atmosphere and the board material. Only at this stage are the boards subjected to an edge preparation process in which they are trimmed to the final size. The waste material is at least partly comminuted and return to the beginning of the process where it is once again added to the chip material prior to the mat forming step.