The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 1983
Filed:
Nov. 04, 1981
Joseph A Roberts, Hudson, NH (US);
Advanced Circuit Technology, Nashua, NH (US);
Abstract
The present invention provides low cost electrical switch assemblies and methods for manufacturing same. The switch assembly comprises an array of resiliently flexible metallic conductors arranged in predetermined circuit pathways on a dielectric carrier panel. A plurality of apertures or cavities are provided at predetermined locations in the carrier panel. The switch contacts comprise a pair of generally L-shaped fingers which are integral extensions of the flexible conductors. The fingers extend from opposite edge surfaces of the carrier panel defining an associated aperture or cavity, to pass one another over or within their associated aperture or cavity, with the free ends of the fingers terminating adjacent one another. The free ends of the L-shaped fingers extend in part above or below the plane of the carrier panel, and are positioned in spaced relationship to one another so that the conductors they connect are normally open, but are sufficiently close to one another so that slight deflection of the fingers from their normal orientation moves the free ends in contact with each other to thereby close the switch. Alternatively, the free ends of the L-shaped fingers are positioned in contact with one another so that slight deflection of the fingers from their normal orientation breaks their contact. The metallic conductors and integral switch contacts may be formed by photoimaging and either chemical milling or additive techniques such as plating up or solder doming, and/or mechanical milling and/or precision die stamping techniques.