The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 1983
Filed:
Jun. 11, 1981
Applicant:
Inventors:
Reginald R Buckley, Summit, NJ (US);
Lucian A D'Asaro, Madison, NJ (US);
Paul A Kohl, Chatham, NJ (US);
Frederick W Ostermayer, Jr, Chatham, NJ (US);
Catherine Wolowodiuk, Chatham, NJ (US);
Assignee:
Bell Telephone Laboratories, Incorporated, Murray Hill, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D / ; C25D / ;
U.S. Cl.
CPC ...
204 15 ; 204 / ;
Abstract
A process is described for plating gold on metal surfaces electrically attached to a compound semiconductor. The procedure is particularly valuable where gold is to be in small holes or crevices in semiconductor structure since electroplating on the semiconductor surface is avoided. The process is useful for providing low inductance electrical connection to various parts of semiconductor devices such as to the source in gallium arsenide field-effect transistors.