The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 1983

Filed:

Aug. 26, 1981
Applicant:
Inventors:

Hiroaki Satoh, Tokyo, JP;

Masaru Hiruta, Iwaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B / ;
U.S. Cl.
CPC ...
252511 ; 524495 ; 524496 ; 525191 ; 525221 ; 525386 ;
Abstract

An electroconductive resin composite material for molding having excellent mechanical strength and electrical properties. The resin comprises 100 parts by weight of polypropylene, from 10 to 50 parts by weight of a modified polypropylene obtained either by chemically modifying polypropylene with an organic unsaturated carboxylic acid or by copolymerizing propylene and the organic unsaturated carboxylic acid, from 5 to 65 parts by weight of carbon fiber having a diameter of 5 to 20 micrometers, the ratio of length to diameter of the fiber being not less than 10, and from 5 to 65 parts by weight of electroconductive carbon black, the specific surface area being at least 800 m.sup.2 /g.


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