The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 1983
Filed:
Sep. 20, 1982
Applicant:
Inventor:
Joseph J Gajda, Wappingers Falls, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
427 90 ; 156643 ; 2041 / ; 427 91 ; 427 96 ; 427 99 ; 430314 ;
Abstract
Controlling Al.sub.2 Cu precipitation in copper doped aluminum by evaporating the aluminum metallurgy containing 3 to 4% copper at about 210.degree. C. on SiO.sub.2 coated semiconductor devices. In multilevel metallurgy sintering can be optionally performed at 400.degree. C. for 75 minutes to cause intermetal diffusion at vias between the metallurgy levels.
Gajda, Joseph. (1983). Aluminum-copper alloy evaporated films with low via resistance (U.S. Patent No. 4393096). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4393096
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile